Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference58 articles.
1. Flip the chip;Wong;Science,2000
2. Encyclopedia of packaging materials, processes, and mechanics: interconnect and wafer bonding technology;Bar-Cohen;Set 1, Sci. World,2019
3. Recent advances in polymer-based electronic packaging materials;Wan;Compos Commun,2020
4. Effect of particle shape of silica mineral on the properties of epoxy composites;Ahmad;Compos Sci Technol,2008
5. Study on mono-dispersed nano-size silica by surface modification for underfill applications;Sun;J Colloid Interface Sci,2005
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