Recent advances in polymer-based electronic packaging materials-Reference-Cited by-同舟云学术

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Recent advances in polymer-based electronic packaging materials

Published:2020-06 Issue: Volume:19 Page:154-167
ISSN:2452-2139
Container-title:Composites Communications
language:en
Short-container-title:Composites Communications

Author:

Wan Yan-Jun,Li Gang,Yao Yi-Min,Zeng Xiao-Liang,Zhu Peng-Li,Sun Rong

Funder

BN

China Postdoctoral Science Foundation

National Natural Science Foundation of China

Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

Publisher

Elsevier BV

Subject

Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Ceramics and Composites

Reference63 articles.

1. Springer Handbook of Electronic and Photonic Materials;Kasap,2017

2. Recent advances in flip-chip underfill: materials, process, and reliability;Zhang;IEEE Trans. Adv. Packag.,2004

3. Study on mono-dispersed nano-size silica by surface modification for underfill applications;Sun;J. Colloid Interface Sci.,2005

4. High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging;Chen;Compos. Sci. Technol.,2014

5. Study of capillary underfill filler separation in advanced flip chip packages;Paquet,2017

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1. Fly ash-based zeolite/reduced graphene oxide/polymer anti-corrosion coatings for efficient heat dissipation;Progress in Organic Coatings;2024-11

2. Epoxy composite films of superior dielectric properties promoted by active ester hardeners for applications in electronic packaging;European Polymer Journal;2024-11

3. A novel cycloaliphatic epoxy monomer with inherent imide and phosphate groups enabled highly flame-retardant epoxy resin;Reactive and Functional Polymers;2024-10

4. Constructing phonon transport bridges via low-temperature sintering in Diamond@Ag/EP composite to achieve efficient 3D networks structure;Chemical Engineering Journal;2024-09

5. New type of UV cured low dielectric naphthalene resin: Structure-activity relationship of different substitution sites;Progress in Organic Coatings;2024-09

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