Author:
Sun Yangyang,Zhang Zhuqing,Wong C.P.
Subject
Colloid and Surface Chemistry,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Flip the Chip
2. C.P. Wong, S.H. Shi, U.S. Patent 6,180,696, 2001
3. Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application
4. K. Gross, S. Hackett, D. Larkey, W. Schultz, W. Thompson, in: Proc. International Symposium on Microelectronics (IMAPS), Denver, CO, 2002, p. 234
5. Rheology of Filled Polymer Systems;Shenoy,1999
Cited by
204 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献