Flip the Chip-Reference-Cited by-同舟云学术

Flip the Chip

Published:2000-12-22 Issue:5500 Volume:290 Page:2269-2270
ISSN:0036-8075
Container-title:Science
language:en
Short-container-title:Science

Author:

Wong C. P.¹,Luo Shijian¹,Zhang Zhuqing¹

Affiliation:

1. The authors are at the School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference10 articles.

1. Tummala R. R., Rymaszewski E. J., Klopfenstein A. G., Microelectronics Packaging Handbook (Chapman & Hall, New York, 1997)[publisher's information].

2. Wong C. P., Ed.Polymers for Electronic and Photonic Applications (Academic Press, San Diego, CA, 1993).

3. Miller L. F., IBM J. Res. Dev.13, 239 (1969).

4. Inoue T., et al., Proceedings of 41st Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 1991), pp. 704-709.

5. Suryanarayana D., et al., Proceedings of 40th Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 1990), pp. 338-343.

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