Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application-Reference-Cited by-同舟云学术

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Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application

Published:1999-10 Issue:4 Volume:22 Page:331-339
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:en
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Songhua Shi ,Wong C.P.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/17699/00816104.pdf?arnumber=816104

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Study of flip ultrasonic bonding process with Non-conductive paste;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

3. Two photosensitive chalcone-based benzoxazine monomers and their high-performance polymers from renewable sources;Journal of Materials Science;2022-01-29

4. Modelling Technologies and Applications;Nanopackaging;2018

5. Nano-underfills and Potting Compounds for Fine-Pitch Electronics;Nanopackaging;2018

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