1. Shi SH, Wong CP (1999) Recent advances in the development of no-flow underfill encapsulants – a practical approach towards the actual manufacturing application. IEEE Trans Electron Packag Manuf 22:331–339
2. Liu J, Kraszewshi R, Lin X, Wong L, Goh SH, Allen J (2001) New developments in single pass reflow Encapsulant for Flip Chip application. In: Proceedings of international symposium on advanced packaging materials, Atlanta, March 2001, pp 74–79
3. Jong-Keun H, Cho K-K, Kim K-W, Nam T-H, Ahn H-J, Cho G-B (2007) Consideration of Fe nanoparticles and nanowires synthesized by chemical vapor condensation process. Mater Sci Forum 534–536:29–32
4. Dong-Joo K, Kim K-S, Zhao Q-Q (2003) Production of monodisperse nanoparticles and application of discrete-monodisperse model in plasma reactors. J Nanopart Res 5:3–4
5. Paul H, Weener J-W, Roman C, Harper T (2003) Nanoparticles, Technology White Papers, No. 3, www.ceintifica.com , pp 1–11