Effect of particle shape of silica mineral on the properties of epoxy composites

Author:

Ahmad Farrah Noor,Jaafar Mariatti,Palaniandy Samayamutthirian,Azizli Khairun Azizi Mohd

Publisher

Elsevier BV

Subject

General Engineering,Ceramics and Composites

Reference22 articles.

1. Processing mechanics for flip–chip assemblies;Wang;Comput Struct,1998

2. Study on mono-dispersed nano-size silica by surface modification of underfill applications;Sun;J Colloid Interf Sci,2005

3. Curing kinetics and optimal cure schedules for underfill materials;Hsu;Microelectron J,2001

4. Ahmad FN. Studies on various shapes of silica mineral fillers on the properties of epoxy for underfill application. USM MSc Thesis. Penang: Universiti Sains Malaysia; 2006.

5. Board design for flip chips and chip-scale package underfill;Adamson;Electron Bull Hong Kong,2003

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