Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation-Reference-Cited by-同舟云学术

Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

Published:2024-07 Issue: Volume:281 Page:111519
ISSN:1359-8368
Container-title:Composites Part B: Engineering
language:en
Short-container-title:Composites Part B: Engineering

Author:

Liu Yang,Chen Chuantong,Wang Ye,Zhang Zheng,Liu Ran,Ueshima Minoru,Ota Ichiro^ORCID,Nishikawa Hiroshi,Nishijima Masahiko^ORCID,Nakayama Koji S.,Suganuma Katsuaki

Funder

NEDO

Japan Science and Technology Agency

Daicel

Murata Science Foundation

Japan Society for the Promotion of Science

Publisher

Elsevier BV

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