Modeling a Ni/β-Ga2O3 Schottky barrier diode deposited by confined magnetic-field-based sputtering

Abstract

Abstract In this work, a detailed numerical simulation is carried out to model the current–voltage characteristics of a nickel/β-Ga2O3 Schottky barrier diode at different temperatures. These SBDs are produced using confined magnetic-field-based sputtering to deposit the nickel (Ni) Schottky contact of the diode. This method reduces the thickness of the defect area created by plasma and argon bombardment, and consequently, the electrical characteristics are less affected by temperature changes or annealing (i.e. the device is more stable). During annealing, Ni diffuses into β-Ga2O3. A model for this diffusion is proposed in this work, in which Ni diffusion reduces the defects produced by plasma and argon bombardment by filling the Ga vacancy. Furthermore, Ni diffusion produces a new interfacial compound, namely (N i x G a 1 − x ) 2 O 3 at the interface between the Ni and the β-Ga2O3. This new compound layer has different properties than those of β-Ga2O3, in particular, those of the bandgap and the affinity. Finally, the temperature-dependent current-density–voltage (J–V) characteristics are simulated, taking the proposed model into account. A good agreement with measured values is achieved, especially at low forward voltages, which demonstrates the soundness of the proposed model.