Experimental and theoretical investigation of bifurcated wafer warpage evolution in the wafer level packaging processes-Reference-Cited by-同舟云学术

Experimental and theoretical investigation of bifurcated wafer warpage evolution in the wafer level packaging processes

Published:2020-08-18 Issue:19 Volume:31 Page:16531-16538
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Zhu Chunsheng^ORCID

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s10854-020-04207-8.pdf

Reference20 articles.

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3. E. Herth, S. Seok, N. Rolland, T. Lasri, Wafer level packaging compatible with millimeter-wave antenna. Sens. Actuators A 173(1), 238–243 (2012)

4. S. Seok, 9—Wafer-level packaging technology for RF MEMS A2—Uttamchandani, Handbook of mems for wireless and mobile applications (Woodhead Publishing, Deepak, 2013), pp. 258–290

5. M.-L. Huang, N. Zhao, S. Liu, Y.-Q. He, Drop failure modes of Sn–3.0Ag–0.5Cu solder joints in wafer level chip scale package. Trans. Nonferrous Metals Soc. China 26(6), 1663–1669 (2016)

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