Trends of power semiconductor wafer level packaging-Reference-Cited by-同舟云学术

Trends of power semiconductor wafer level packaging

Published:2010-04 Issue:4 Volume:50 Page:514-521
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Liu Yong

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference39 articles.

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3. Lorenz L. Key power semiconductor devices and development trends. In: physics of semiconductor device. IWPSD 2007. p. 743–50.

4. Power semiconductor device for hybrid, electric, and fuel cell vehicles;Shen;Proc IEEE,2007

5. Power electronics and motor drives in electric, hybrid electric and plug-in hybrid electric vehicles;Emadi;IEEE Trans Indus Electron,2008

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