Reliability of Wafer Level Chip Scale Packages-Reference-Cited by-同舟云学术

Reliability of Wafer Level Chip Scale Packages

Published:2014-09 Issue:9-10 Volume:54 Page:1988-1994
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Rongen R.,Roucou R.,vd Wel P.J.,Voogt F.,Swartjes F.,Weide-Zaage K.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Description designation system for semiconductor-device packages. In: JESD30F; August 2008.

2. Stress-test-driven qualification of integrated circuits. In: JESD47I; July 2012.

3. Application specific qualification using knowledge based test methodology. In: JESD94A; September 2011.

4. ZVEI handbook for robustness validation of semiconductor devices in automotive applications, 2nd ed.; March 2013.

5. Failure mechanisms and models for semiconductor devices. In: JEP122G; October 2011.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Acceptance Criteria for Good Solder Joint Reliability On Wafer Level Chip Scale Package (WLCSP) at Component Level;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Advanced Chip Last Process Integration for Fan Out WLP;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Semi-empirical law for fatigue resistance of redistribution layers in chip-scale packages;Microelectronics Reliability;2021-05

4. Experimental and theoretical investigation of bifurcated wafer warpage evolution in the wafer level packaging processes;Journal of Materials Science: Materials in Electronics;2020-08-18

5. Semi-empirical law for fatigue resistance of redistribution layers in chip-scale packages;2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2020-07