Acceptance Criteria for Good Solder Joint Reliability On Wafer Level Chip Scale Package (WLCSP) at Component Level
Author:
Affiliation:
1. Nexperia (Malaysia) Sdn Bhd Tuanku Jaafar Industrial Park,Seremban,Negeri Sembilan,Malaysia
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457691.pdf?arnumber=10457691
Reference6 articles.
1. Reliability of Wafer Level Chip Scale Packages
2. Formation and Growth of Intermetallics at the Interface Between Lead-free Solders and Copper Substrates;Siewert;NIST,2003
3. Designing for reliability using a new Wafer Level Package structure
4. Emprical Model for Degradation of IMC in SACQ Solder Bumps During High Temperature Storage;Bestroy;Article Microelectronics Reliability
5. Electromigration in WLCSP solder bumps
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