Author:
HUANG Ming-liang,ZHAO Ning,LIU Shuang,HE Yi-qian
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference18 articles.
1. Electromigration reliability and current carrying capacity of various WLCSP interconnect structures [C];AHMER,2013
2. Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices [J];ZHANG;Microelectronics Reliability,2014
3. Effect of Sb content on properties of Sn–Bi solders [J];ZHANG;Transactions of Nonferrous Metals Society of China,2014
4. Interfacial microstructure and mechanical properties of In–Bi–Sn lead-free solder [J];HUANG;Journal of Materials Science: Materials in Electronics,2013
5. Creep behavior of SnAgCu solders with rare earth Ce doping [J];ZHANG;Transactions of Nonferrous Metals Society of China,2010
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