Influence of bismuth addition on the physical and mechanical properties of low silver/lead-free Sn-Ag-Cu solder
Author:
Funder
King Khalid University Deanship of Scientific Research
Publisher
Elsevier BV
Reference52 articles.
1. Combined effects of Bi and Sb elements on microstructure, thermal and mechanical properties of Sn−0.7Ag−0.5Cu solder alloys;Chantaramanee;Trans. Nonferrous Met. Soc. China,2022
2. Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn−0.7Cu solder alloy/substrate couples;Lima;J. Electron. Mater.,2020
3. Al and Si alloying effect on solder joint reliability in Sn-0.5Cu for automotive electronics;Hong;J. Electron. Mater.,2016
4. A review of lead-free solders for electronics applications;Cheng;Micro Rel.,2017
5. Drop failure modes of Sn−3.0Ag−0.5Cu solder joints in wafer level chip scale package;Huang;Trans. Nonferrous Met. Soc. China,2016
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