Preparation and Soldering Performance of Sac305@Sn-Bi Core-Shell Solder Balls Based on Eutectic Co-Deposition

Author:

Shang Min,Yao Jinye,Zhang Dan,Su Xiaolin,Ma Haitao,Wang Yunpeng,Ma Haoran

Publisher

Elsevier BV

Reference46 articles.

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3. Drop failure modes of sn-3.0ag-0.5cu solder joints in wafer level chip scale package;M L Huang;Transactions of Nonferrous Metals Society of China,2016

4. Research and Development of Core-shell Nanocomposites;Limei Tang;Materials Report,2016

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