Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices-Reference-Cited by-同舟云学术

Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices

Published:2014-01 Issue:1 Volume:54 Page:281-286
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zhang Liang,Han Ji-guang,Guo Yonghuan,He Cheng-wen

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference38 articles.

1. Interfacial reactions between eutectic Sn–Pb solder and Co substrate;Wang;J Mater Sci,2011

2. Microstructural evolution of intermetallic compounds in Sn–3.5Ag–X(x=0.75Ni, 1.0Zn and 1.5In)/Cu solder joints during liquid aging;Chen;J Alloy Compd,2010

3. Microstructural evolution and tensile properties of Sn–Ag–Cu mixed Sn–Pb solder alloys;Wang;J Alloy Compd,2009

4. Effects of trace amount addition of rare earth on properties and microstructure of Sn–Ag–Cu alloys;Zhang;J Mater Sci Mater Electron,2009

5. Effects of small amount addition of rare earth Er on microstruucture and property of SnAgCu solder;Shi;J Alloy Compd,2008

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