Thermal fatigue life prediction of Ag-2.5Sn solder joint in flip chip-Reference-Cited by-同舟云学术

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Thermal fatigue life prediction of Ag-2.5Sn solder joint in flip chip

Published:2024-04-30 Issue: Volume: Page:1-16
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Yang Hui¹,Xu Zhengyu²

Affiliation:

1. Education Department of Guangxi Zhuang Autonomous Region, Key Laboratory of Advanced Manufacturing and Automation Technology (Guilin University of Technology), Guilin, People’s Republic of China

2. College of Mechanical and Control Engineering, Guilin University of Technology, Guilin, People’s Republic of China

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/01694243.2024.2345955

Reference18 articles.

1. Solder technologies for electronic packaging and assembly;Hwang JS.;Electronic Packaging Interconnection Handbook,2000

2. P. Polymers in electronic packaging;Wong C.;Electronic Packaging and Interconnection Handbook,2000

3. A review on cyclic deformation damage and fatigue fracture behavior of metallic nanolayered composites

4. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

5. Optimization and simulation of nano-silver paste sintered copper interconnection process

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