Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy
Link
http://stacks.iop.org/1742-6596/841/i=1/a=012014/pdf
Reference9 articles.
1. Finite element modeling and characterization of lead-free solder joints fatigue life during power cycling of surface mounting power devices
2. Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling
3. Fatigue life evaluation accuracy of power devices using finite element method
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of Die Thickness on the Reliability of Solder Joint in Clip-bonded Packages;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
2. Finite Element Analysis of Si and SiC Power Modules for Accurate Reliability Assessment;2022 IEEE Aerospace Conference (AERO);2022-03-05
3. Review of Methodologies for Structural Integrity Evaluation of Power Modules;Journal of Electronic Packaging;2020-08-27
4. Methodologies for Structural Integrity Evaluation of Power Semiconductor Modules;Journal of The Japan Institute of Electronics Packaging;2020-03-01
5. Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints;Microelectronics Reliability;2019-02
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