Methodologies for Structural Integrity Evaluation of Power Semiconductor Modules
Author:
Affiliation:
1. Green Electronics Research Institute, Kitakyushu
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/23/2/23_173/_pdf
Reference120 articles.
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4. 5) M. Ciappa: "Selected failure mechanisms of modern power modules," Microelectronics Reliability, Vol. 42, Nos. 4–5, pp. 653–667, 2002
5. 6) S. Yang, D. Xiang, A. Bryant, P. Mawby, L. Ran, and P. Tavner: "Condition monitoring for device reliability in power electronic converters: A review," IEEE Transactions on Power Electronics, Vol. 25, No. 11, pp. 2734–2752, 2010
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