Selected failure mechanisms of modern power modules-Reference-Cited by-同舟云学术

Selected failure mechanisms of modern power modules

Published:2002-04 Issue:4-5 Volume:42 Page:653-667
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ciappa Mauro

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference32 articles.

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4. Crack mechanism in wire bonding joints;Ramminger;Microelectron. Reliab.,1998

5. Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules;Hamidi;Microelectron. Reliab.,1999

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