1. Investigations on the damage mechanism of aluminum wire bonds used for high-power applications;Poech,1996
2. Fast power cycling test for IGBT modules in traction application;Held,1997
3. Reliability of high power IGBT modules — Testing on thermal fatigue effects due to traction cycles;Hamidi,1997
4. A power-Cycling-Induced Failure Mechanism of IGBT Multichip Modules;Malberti,1995