State-of-the-art of the bond wire failure mechanism and power cycling lifetime in power electronics

Author:

Xie Luhong,Deng Erping,Yang Shaohua,Zhang Ying,Zhong Yan,Wang Yanhao,Huang Yongzhang

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference86 articles.

1. Aging mechanisms and accelerated lifetime tests for SiC MOSFETs: an overview;Pu;IEEE J. Emerg. Sel. Top. Power Electron.,2022

2. State detection of bond wires in IGBT modules using Eddy current pulsed thermography;Li;IEEE Trans. Power Electron.,2014

3. Investigation on isolated failure mechanisms in active power cycle testing;Junghaenel,2015

4. Fast power cycling test of IGBT modules in traction application;Held,1997

5. Thermal–mechanical behavior of the bonding wire for a power module subjected to the power cycling test;Hung;Microelectron. Reliab.,2011

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4. Influence of Geometry Effects on Thermo-Mechanical Reliability of Aluminum Bond Wires in Discrete SiC MOSFETs;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

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