Author:
Hung T.Y.,Chiang S.Y.,Huang C.J.,Lee C.C.,Chiang K.N.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Present problems of power module packaging technology;Shammas;Microelectron Reliab,2003
2. Failure modes and FEM analysis of power electronic packaging;Ye;Finite Elem Anal Des,2002
3. Selected failure mechanisms of modern power modules;Ciappa;Microelectron Reliab,2002
4. Packaging factors affecting the fatigue life of power transistor die bonds;Evans;Compon, Pack, Manuf, Techno, Part A, IEEE Trans,1998
5. Reliability evaluation on deterioration of power device using coupled electrical–thermal–mechanical analysis;Anzawa;Electron Pack,2010
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