Synergistically enhanced Si3N4/Cu heterostructure bonding by laser surface modification-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Synergistically enhanced Si3N4/Cu heterostructure bonding by laser surface modification

Published:2024-05 Issue: Volume:182 Page:187-197
ISSN:1005-0302
Container-title:Journal of Materials Science & Technology
language:en
Short-container-title:Journal of Materials Science & Technology

Author:

Song Yanyu,Zhu Haitao,Liu Duo,Song Xiaoguo,Bian Hong,Fu Wei,Lin Danyang,Tan Caiwang,Cao Jian

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference37 articles.

1. Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature

2. Power Conversion With SiC Devices at Extremely High Ambient Temperatures

3. Thermal–mechanical behavior of the bonding wire for a power module subjected to the power cycling test

4. Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of temperature on the mechanical properties of Ni-based superalloys via molecular dynamics and crystal plasticity;Journal of Materials Science & Technology;2024-12

2. Achieving (TiZrTaNbCr)C/Zr alloy brazed joints with outstanding high-temperature oxidation resistance and mechanical property;Materials Characterization;2024-11

3. Obtaining in-situ reacted Fe–W–Ni–Cr–Cu high-entropy alloy within the interlayer of dissimilar Cf/SiC-GH3536 joint by designing non-high-entropy Cu–Ti–W composite filler;Materials Science and Engineering: A;2024-10

4. Microstructure evolution and mechanical properties of SiC/Mo joint brazed with FeCoCrNi high-entropy alloy filler;Ceramics International;2024-08

5. A convenient fabrication strategy of laminated graphene/aluminum composite via pulse current diffusion bonding;Ceramics International;2024-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3