Present problems of power module packaging technology-Reference-Cited by-同舟云学术

Present problems of power module packaging technology

Published:2003-04 Issue:4 Volume:43 Page:519-527
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Shammas N.Y.A

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference30 articles.

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4. Effects of external operating conditions on the reverse receovery behaviour of fast power diodes;Shammas;Eur. Power Electron. Drives J.,1999

5. Semiconductor devices efficiency comparison based on resistive swtiching of the MOSFET, BJT and IGBT;Shammas,1995

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