Investigation of Creep Failure in Ag-4Pd Bonding Wire Under Dynamic Mechanical Analysis Tests-Reference-Cited by-同舟云学术

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Investigation of Creep Failure in Ag-4Pd Bonding Wire Under Dynamic Mechanical Analysis Tests

Published:2023-12 Issue:12 Volume:13 Page:1944-1950
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Chen Chun-Hao¹^ORCID,Chiang Meng-Ting²,Chuang Tung-Han²^ORCID

Affiliation:

1. International College of Semiconductor Technology, National Yang Ming Chiao Tung University, Hsinchu, Taiwan

2. Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan

Funder

Emerging Technology Application Program of the Hsinchu Science Park Research and Development Program of Ag Materials Technology Company Ltd.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10382162/10335733.pdf?arnumber=10335733

Reference45 articles.

1. Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging

2. Materials selection issues for high operating temperature (HOT) electronic packaging

3. Leading edge die stacking and wire bonding technologies for advanced 3D memory packages

4. Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

5. Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling

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