Enhancing Electrical Ruggedness in Double-Sided Cooled Power Modules-Reference-Cited by-同舟云学术

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Enhancing Electrical Ruggedness in Double-Sided Cooled Power Modules

Published:2024-06-09 Issue: Volume: Page:1-4
ISSN:
Container-title:2024 19th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)
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Author:

Scognamillo Ciro¹,Catalano Antonio Pio¹,Codecasa Lorenzo²,Castellazzi Alberto³,D'Alessandro Vincenzo¹

Affiliation:

1. University Federico II,Department of Electrical Engineering and Information Technology,Naples,Italy

2. Information and Bioengineering, Politecnico di Milano,Department of Electronics,Milan,Italy

3. Kyoto University of Advanced Science,Solid-State Power Processing (SP2) Lab, Faculty of Engineering,Kyoto,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10559643/10559661/10559704.pdf?arnumber=10559704

Reference14 articles.

1. Innovative and Reliable Power Modules: A Future Trend and Evolution of Technologies

2. A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues

3. Present problems of power module packaging technology

4. Comprehensive Review and State of Development of Double-Sided Cooled Package Technology for Automotive Power Modules

5. Numerical Simulation and Analytical Modeling of the Thermal Behavior of Single- and Double-Sided Cooled Power Modules

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