Comprehensive Review and State of Development of Double-Sided Cooled Package Technology for Automotive Power Modules
Author:
Affiliation:
1. General Motors LLC, Detroit, MI, USA
Funder
General Motors Research and Development
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Medicine
Link
http://xplorestaging.ieee.org/ielx7/8782709/9669092/09769770.pdf?arnumber=9769770
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