Bond-pad damage in ultrasonic wedge bonding-Reference-Cited by-同舟云学术

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Bond-pad damage in ultrasonic wedge bonding

Published:2024-01 Issue: Volume:152 Page:115279
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Khajehvand Milad,Seppänen Henri,Sepehrband Panthea

Funder

National Science Foundation

National Science Foundation Division of Civil Mechanical and Manufacturing Innovation

Santa Clara University

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference53 articles.

1. A review on the mechanisms of ultrasonic wedge-wedge bonding;Long;J. Mater. Process. Technol.,2017

2. A brief review of selected aspects of the materials science of ball bonding;Breach;Microelectron. Reliab.,2010

3. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization;Schemmel;Microelectron. Reliab.,2021

4. Analysis of the friction processes in ultrasonic wedge/wedge-bonding;Gaul;Microsyst. Technol.,2009

5. Comparative analysis of the process window of aluminum and copper wire bonding for power electronics applications;Kaestle,2014

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