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A review on the mechanisms of ultrasonic wedge-wedge bonding

  • Published:2017-07 Issue: Volume:245 Page:241-258
  • ISSN:0924-0136
  • Container-title:Journal of Materials Processing Technology
  • language:en
  • Short-container-title:Journal of Materials Processing Technology

Author:

Long Yangyang,Twiefel Jens,Wallaschek Jörg

Funder

Ministry of Science and Culture of Lower Saxony, Germany

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference163 articles.

1. Ultrasound in Liquid and Solid Metals;Abramov,1994

2. A friction based approach for modeling wire bonding;Althoff,2013

3. Improving the bond quality of copper wire bonds using a friction model approach;Althoff,2014

4. Technique for connecting electrical leads to semiconductors;Anderson;J. Appl. Phys.,1957

5. Characterising the Effective Material Softening in Ultrasonic Forming of Metals (Doctoral Dissertation);Aziz,2012

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