Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization

Author:

Schemmel Reinhard,Krieger Viktor,Hemsel Tobias,Sextro Walter

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference41 articles.

1. The nordic electronics packaging guideline, chapter a: wire bonding, Tech. Rep;Lai,2000

2. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding;Schemmel;Sensors and Actuators A: Physical,2019

3. Process advantages of thermosonic wedge-wedge bonding using dosed tool heating;Hunstig;International Symposium on Microelectronics,2019

4. Copper wire bonding concerns and best practices;Chauhan;J. Electron. Mater.,2013

5. A high-efficiency low-cost wire-bond loop antenna for cmos wafers;Kim,2009

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