Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding-Reference-Cited by-同舟云学术

Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding

Published:2019-08 Issue: Volume:295 Page:653-662
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Schemmel Reinhard,Hemsel Tobias,Dymel Collin,Hunstig Matthias,Brökelmann Michael,Sextro Walter

Funder

European Regional Development Fund in North Rhine-Westphalia

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference46 articles.

1. Wire bonding as a technique for semiconductor device assembly;Weston;Microelectron. Int.,1985

2. A review on the mechanisms of ultrasonic wedge-wedge bonding;Long;J. Mater. Process. Technol.,2017

3. Numerical and experimental investigations in ultrasonic heavy wire bonding;Schemmel;6th European Conference on Computational Mechanics (ECCM 6),2018

4. Experimental and numerical simulation study of pre-deformed heavy copper wire wedge bonds;Unger,2014

5. Self-cleaning mechanisms in ultrasonic bonding of al wire;Long;J. Mater. Process. Technol.,2018

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