Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
Author:
Affiliation:
1. Paderborn University,Chair of Dynamics and Mechatronics,Paderborn,Germany
2. Infineon Technologies AG,Warstein,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939478.pdf?arnumber=9939478
Reference15 articles.
1. Welding Characteristics of Ultrasonic Wire Bonding Using High-Frequency Vibration Systems
2. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
3. Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding;schemmel;International Conference on Integrated Power Electronic Systems (CIPS),2020
4. Segmentation Models;yakubovskiy;Git Hub Git Hub repository,0
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