Author:
Chauhan Preeti,Zhong Z. W.,Pecht Michael
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference161 articles.
1. L. Levine and M. Sheaffer, Copper ball bonding. Semicond. Int. 9, 126–129 (1986).
2. C.J. Vath, M. Gunasekaran, and R. Malliah, Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage. Microelectron. Reliab. 51, 137–147 (2011).
3. K. Tsumura, US Patent 5,116,783 (1992).
4. Z.W. Zhong, Overview of wire bonding using copper wire or insulated wire. Microelectron. Reliab. 51, 4–12 (2011).
5. S. ChipPAC Copper wirebond. http://www.statschippac.com/news/newscenter/2011/~/media/Files/Package%20Datasheets/Cu_wb.ashx . Accessed 15 Apr 2013
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