Author:
Gaul Holger,Schneider-Ramelow M.,Reichl H.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference9 articles.
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4. Geißler U, Schneider-Ramelow M, Lang K-D, Reichl H (2006) Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires. J Electron Mater, Jg. 35, H. 1, S173–S179
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