Author:
Ramminger S.,Türkes P.,Wachutka G.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. Oberflächen für das Bonden mit AlDickdraht;Hauke;PRONIC 5,1993
2. Reliability Testing And Analysis Of IGBT Power Semiconductor Modules;Jacob;Coll. “IGBT Propulsion Drives”,1995
3. Reliability Testing And Analysis Of IGBT Power Semiconductor Modules;Jacob;Coll. “IGBT Propulsion Drives”,1995
4. Investigations on the damage mechanism of aluminum wire bonds used for highpower applications;Poech,1996
5. Plastic-Strain Of Aluminum Interconnects During Pulsed Operation Of IGBT Multichip Modules;Ciappa;Qual. Rel. Eng. Int.,1996
Cited by
56 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献