A Time-Efficient Strain-Based Lifetime Prediction Method for Bond Wires Using Vibration Fatigue Tests and Finite Element Modeling-Reference-Cited by-同舟云学术

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A Time-Efficient Strain-Based Lifetime Prediction Method for Bond Wires Using Vibration Fatigue Tests and Finite Element Modeling

Published:2024-02 Issue:1 Volume:12 Page:1011-1019
ISSN:2168-6777
Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
language:
Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Ye Junjie¹^ORCID,Yang Xin²^ORCID,Dai Xingyu³,Wu Xinlong²^ORCID,Heng Ke⁴^ORCID,Liu Guoyou⁵^ORCID

Affiliation:

1. Dongguan Power Supply Bureau of Guangdong Power Grid Corporation, Dongguan, China

2. College of Electrical and Information Engineering, Hunan University, Changsha, China

3. Power China Zhongnan Engineering Corporation Ltd., Changsha, China

4. Xuzhou Power Supply Company of State Grid Jiangsu Electric Power Company Ltd., Xuzhou, China

5. CRRC Zhuzhou Electric Locomotive Institute Company Ltd., Zhuzhou, China

Funder

National Natural Science Foundation of China

Provincial Natural Science Foundation of Hunan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Link

http://xplorestaging.ieee.org/ielx7/6245517/10419148/10331921.pdf?arnumber=10331921

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation on reproduction of IGBT die-attach solder degradation with finite element thermal-mechanical simulation;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

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