Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys-Reference-Cited by-同舟云学术

Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys

Published:2009-05 Issue:1-2 Volume:477 Page:267-273
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Wang Fengjiang,O’Keefe Matthew,Brinkmeyer Brandon

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference11 articles.

1. Lead-free Solders in Microelectronics

2. International Printed Circuit Association Solder Products Value Council, White Paper: IPC-SPVC-WP-006 Round Robin Testing and Analysis, Lead Free Alloys: Tin, Silver, Copper, August 12, 2003.

3. C.K. Chung, R. Aspandiar, K.F. Leong, C.S. Tay. The interactions of lead (Pb) in lead free solder (Sn/Ag/Cu) system, 2002 ectc, pp. 168–175.

4. Effects of Pb contamination on the eutectic Sn‐Ag solder joint

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