Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties
Author:
Funder
China Scholarship Council
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference64 articles.
1. Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance
2. Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
3. Improving thermal shock response of interfacial IMCs in Sn–Ag–Cu joints by using ultrathin-Ni/Pd/Au metallization in 3D-IC packages
4. Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis
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