Effect of Indium on Microstructures and Mechanical Properties of Bismuth-Based High Temperature Solders
Author:
Affiliation:
1. Graduate School of Advanced Science and Engineering, Hiroshima University
2. State Key Laboratory of Metastable Materials Science and Technology, Yanshan University
Publisher
Japan Institute of Metals
Link
https://www.jstage.jst.go.jp/article/matertrans/advpub/0/advpub_MT-M2024067/_pdf
Reference30 articles.
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3. 3) Z.L. Ma, H. Shang, A.A. Daszki, S.A. Belyakov and C.M. Gourlay: Mechanisms of beta-Sn nucleation and microstructure evolution in Sn-Ag-Cu solders containing titanium, J. Alloy. Compd. 777 (2019) 1357–1366. doi:10.1016/j.jallcom.2018.11.097
4. 4) R. Sayyadi and H. Naffakh-Moosavy: Physical and mechanical properties of synthesized low Ag/lead-free Sn-Ag-Cu-xBi (x = 0, 1, 2.5, 5 wt%) solders, Mater. Sci. Eng. A 735 (2018) 367–377. doi:10.1016/j.msea.2018.08.071
5. 5) A.A. El-Daly, A.M. El-Taher and S. Gouda: Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly, J. Alloy. Compd. 627 (2015) 268–275. doi:10.1016/j.jallcom.2014.12.034
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