Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability-Reference-Cited by-同舟云学术

Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability

Published:2017-08 Issue: Volume:702 Page:371-385
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Khodabakhshi F.,Sayyadi R.,Javid N. Shahamat

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference58 articles.

1. A review: On the development of low melting temperature Pb-free solders

2. 186. Reaction brazing of polycrystalline graphites by high-melting solders

3. Development of high-temperature solders: Review

4. Thermoset curing through Joule heating of nanocarbons for composite manufacture, repair and soldering

5. Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder

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