Effect of Ni-RGO nanosheets on the creep behavior of Sn–Ag–Cu composite solder joints-Reference-Cited by-同舟云学术

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Effect of Ni-RGO nanosheets on the creep behavior of Sn–Ag–Cu composite solder joints

Published:2024-10 Issue: Volume:325 Page:129773
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Zhang Hehe,Xu Ziqi,Guo Chunjiang,Wu Baoan,Liu Haiding,Li Feng,Zhang Liping^ORCID,Xiao Yuchen

Funder

Natural Science Foundation Project of Chongqing

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference35 articles.

1. Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints;Bani Hani;Sci. Rep.,2023

2. Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints;Hu;Mater. Sci. Eng.: Struct.,2016

3. Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates;Hu;J. Alloys Compd.,2017

4. Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules;Zhang;Scripta Mater.,2013

5. Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part II. Creep behavior of bulk solder and solder/copper joints;Sidhu;Metall. Mater. Trans. A,2007

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