Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference25 articles.
1. Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder
2. Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu
3. Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders
4. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate
5. Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions
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1. Investigation into the strength of β-Sn/α-CoSn3 and Co/α-CoSn3 interfaces with Ni-doped α-CoSn3 using first-principles calculations;Computational Materials Science;2024-10
2. Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys;Journal of Thermal Analysis and Calorimetry;2024-05
3. Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications;Physica Scripta;2024-04-04
4. Retarding microstructural evolution of multiple-elemental SnAgCu solder joints during thermal cycling by strengthening Sn matrix;Journal of Materials Science;2023-02-22
5. Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy;Journal of Materials Science: Materials in Electronics;2023-02-21
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