Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference26 articles.
1. Revisiting mechanisms to inhibit Ag3Sn plates in Sn–Ag–Cu solders with 1wt.% Zn addition;Luo;J Alloys Compd,2010
2. Effects of Ti addition to Sn–Ag and Sn–Cu solders;Chen;J Alloys Compd,2012
3. Influence of thermal aging on microhardness and microstructure of Sn–0.3Ag–0.7Cu–xIn lead-free solders;Kanlayasiri;J Alloys Compd,2010
4. Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy;Kanlayasiri;J Alloys Compd,2009
5. Mechanisms of deformation in high-ductility Ce-containing Sn–Ag–Cu solder alloys;Xie;Microelectron Reliab,2011
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