Investigating the influence of rotating magnetic field (RMF) on intermetallic compound crystallization, thermal and mechanical properties in lead-free Sn-Ag-Cu solder alloys during solidification
Author:
Funder
King Khalid University
King Khalid University Research Center for Advanced Material Science
Publisher
Elsevier BV
Reference56 articles.
1. Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability;Khodabakhshi;Mater. Sci. Eng. A,2017
2. Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor;Jung;J. Alloy. Compd.,2018
3. Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy;Gumaan;J. Mater. Sci: Mater. Electron,2018
4. Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder;Maleki;Act. Mater.,2013
5. Microstructural infuences on thermomechanical fatigue behaviour of third generation high Ag content Pb-free solder alloys;Collins;J. Alloy. Compd.,2016
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