Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference35 articles.
1. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni
2. Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints
3. Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy
4. Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy
5. Mechanical and corrosion resistances of a Sn–0.7wt.%Cu lead-free solder alloy
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1. Incomplete dissolved behavior and mechanical analysis of SnAgCu-SnBi composite solder structures for high-reliable package-on-package techniques;Materials Characterization;2024-09
2. Reliability Risk Mitigation in Advanced Packages by Aging-Induced Precipitation of Bi in Water-Quenched Sn–Ag–Cu–Bi Solder;Materials;2024-07-21
3. Effects of In addition on the properties of Sn–4Ag–0.5Cu–3Bi–0.05Ni solder;Journal of Materials Science: Materials in Electronics;2024-07
4. The Effect of Extended Dwell Time on Thermal Cycling Performance of Hybrid Low Temperature Solder Joints;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
5. Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te;Physica Scripta;2024-05-24
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