Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference20 articles.
1. The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures;Che;J Alloys Compd,2010
2. Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates;Gain;Microelectron Reliab,2011
3. Novel Fe-containing Sn–1Ag–0.5 Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products;Shnawah;Microelectron Reliab,2012
4. A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn–Ag–Cu solder joints;Shnawah;Microelectron Int,2012
5. Strengthening mechanism of SiC-particulate reinforced Sn–3.7Ag–0.9Zn lead-free solder;Wang;J Alloys Compd,2009
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