Thermal, microstructural, wettability and mechanical properties of Sn1.0Ag0.5Cu composite solder modified with Ti nanoparticles
Author:
Funder
Xiamen University of Technology
Publisher
Elsevier BV
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1. Effects of CuO nanoparticles on SAC composite solder joints: Microstructural and DFT study;Journal of Materials Research and Technology;2024-09
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