Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders-Reference-Cited by-同舟云学术

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Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Published:2015-06 Issue: Volume:634 Page:156-162
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Krammer Olivér,Garami Tamás,Horváth Barbara,Hurtony Tamás,Medgyes Bálint,Jakab László

Funder

ProProgressio Foundation

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference27 articles.

1. Investigation of the role of void formation at the Cu-to-intermetallic interface on aged drop test performance;Liu;IEEE Trans. Electron. Packag. Manuf.,2007

2. Interfacial intermetallic growth and shear strength of lead-free composite solder joints;Nai;J. Alloys Comp.,2009

3. H.T. Lee, Y.F. Chen, T.F. Hong, K.T. Shih, Effect of cooling rate on Ag3Sn formation in Sn–Ag based lead-free solder, in: 11th Electronics Packaging Technology Conference, 2009, pp. 875–878.

4. Formation mechanism of eutectic Cu6Sn5 and Ag3Sn after growth of primary B-Sn in Sn–Ag–Cu Alloy;Takamatsu;Mater. Trans.,2011

5. Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint;Tseng;Mater. Lett.,2008

Cited by 32 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of CuO nanoparticles on SAC composite solder joints: Microstructural and DFT study;Journal of Materials Research and Technology;2024-09

2. Thermal, microstructural, wettability and mechanical properties of Sn1.0Ag0.5Cu composite solder modified with Ti nanoparticles;Materials Characterization;2024-06

3. Effects of Thermal Cycling and PCB Substrate Type on Reliability of Solder Joints;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

4. Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

5. Interfacial reaction of Cu/SAC105/Cu solder joints reinforced with Ti nanoparticles under vacuum thermo-compression bonding;Journal of Materials Research and Technology;2024-03

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